Patent · US Active

Semiconductor device having a semiconductor chip, and method for the production thereof

US8574966B2 · kind B2 · utility

6Cited by

9References

9Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Edward Fuergut · Nuremberg, DE

Key dates

Filing date	Mar 19, 2012
Grant date	Nov 5, 2013
Priority date	—
Expiry date	Mar 19, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15311
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device having a semiconductor chip having an active surface with flip-chip contacts and a passive surface is disclosed. The flip-chip contacts are surrounded by an electrically insulating layer as underfill material, the layer having a UV B-stageable material. The UV B-stageable material is applied on the active surface of the semiconductor wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.