Methods and apparatus for cleaning semiconductor wafers

US8580042B2 · kind B2 · utility

Assignee

• ACM RESEARCH (SHANGHAI), INC. · CN

Inventors

• Voha Nuch · Shanghai, CN
• David Xuan-Qi Wang · Fremont, US
• Yue Ma · San Jose, US
• Fufa Chen · Cupertino, US
• Jian Wang · Rosharon, US
• Yunwen Huang · Shanghai, CN
• Liangzhi Xie · Shanghai, CN
• Chuan He · Columbus, US

Key dates

• Filing date: Dec 10, 2007
• Grant date: Nov 12, 2013
• Expiry date: Aug 26, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67051
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An apparatus for cleaning and conditioning the surface of a semiconductor substrate such as wafer includes a rotatable chuck, a chamber, a rotatable tray for collecting cleaning solution with one or more drain outlets, multiple receptors for collecting multiple cleaning solutions, a first motor to drive chuck, and a second motor to drive the tray. The drain outlet in the tray can be positioned directly above its designated receptor located under the drain outlet. The cleaning solution collected by the tray can be guided into designated receptor. One characteristic of the apparatus is having a robust and precisely controlled cleaning solution recycle with minimum cross contamination.