Yunwen Huang
10Patents
2h-index
18Co-inventors
47Inventor score
Filing activity: Nov 2, 2007 → Dec 16, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8518224B2 | Plating apparatus for metallization on semiconductor workpiece | Chemistry; Metallurgy | 3 | Active |
| US8580042B2 | Methods and apparatus for cleaning semiconductor wafers | Electricity | 2 | Active |
| US9492852B2 | Methods and apparatus for cleaning semiconductor wafers | Electricity | 1 | Active |
| US8671961B2 | Methods and apparatus for cleaning semiconductor wafers | Electricity | 1 | Active |
| US9595457B2 | Methods and apparatus for cleaning semiconductor wafers | Electricity | 1 | Active |
| US11670515B2 | Capacitively coupled plasma etching apparatus | Emerging Cross-Sectional Technologies | 0 | Active |
| US10020208B2 | Methods and apparatus for cleaning semiconductor wafers | Electricity | 0 | Active |
| US11515168B2 | Capacitively coupled plasma etching apparatus | Electricity | 0 | Active |
| US9633833B2 | Methods and apparatus for cleaning semiconductor wafers | Electricity | 0 | Active |
| US11373843B2 | Capacitively coupled plasma etching apparatus | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.