Patent · US Active

Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor wafer

US8580070B2 · kind B2 · utility

1Cited by

8References

19Claims

0Family size

Inventors

Edward Fuergut · Nuremberg, DE
Hermann Vilsmeier · Regensburg, DE
Simon Jerebic · Regensburg, DE
Michael Bauer · Nittendorf, DE

Key dates

Filing date	Nov 9, 2005
Grant date	Nov 12, 2013
Priority date	—
Expiry date	Apr 15, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/10158
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a method for making a semiconductor. In one embodiment the method includes applying an adhesive layer to ground-thin or thinned semiconductor chips of a semiconductor wafer. In this embodiment, the adhesive layer composed of curable adhesive is introduced relatively early into a method for the thinning by grinding, separation and singulation of a semiconductor wafer to form thinned semiconductor chips, and is used further in a semiconductor device into which the thinned semiconductor chip is to be incorporated.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.