Plasma apparatus, gas distribution assembly for a plasma apparatus and processes therewith
US8580076B2 · kind B2 · utility
10Cited by
55References
37Claims
0Family size
Assignee
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Key dates
| Filing date | May 22, 2003 |
| Grant date | Nov 12, 2013 |
| Priority date | — |
| Expiry date | Jul 17, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02C20/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma apparatus, various components of the plasma apparatus, and an oxygen free and nitrogen free processes for effectively removing photoresist material and post etch residues from a substrate with a carbon and/or hydrogen containing low k dielectric layer(s).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.