Solder interconnect by addition of copper
US8580621B2 · kind B2 · utility
1Cited by
14References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2013 |
| Grant date | Nov 12, 2013 |
| Priority date | — |
| Expiry date | Jan 29, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming an electronic device provides an electronic device substrate having a solder bump pad located thereover. A nickel-containing layer is located over the solder bump pad. A copper-containing layer is formed on the nickel-containing layer prior to subjecting the electronic device to a reflow process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.