Low cost high frequency device package and methods
US8581113B2 · kind B2 · utility
2Cited by
51References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2007 |
| Grant date | Nov 12, 2013 |
| Priority date | — |
| Expiry date | Jan 10, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.