Detection of substrate warping during rapid thermal processing
US8582963B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 3, 2011 |
| Grant date | Nov 12, 2013 |
| Priority date | — |
| Expiry date | Feb 22, 2032 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27D21/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Apparatus and methods for detecting substrate warping during RTP processing are provided. In one embodiment, one or more beams of light are provided above and across the substrate being processed. In this embodiment, the amount of beam blockage correlates to the amount of substrate warping. In another embodiment, a beam of light is reflected off of a substrate during processing. In this embodiment, the amount of movement of the beam correlates to the amount of substrate warping. In yet another embodiment, a region of a substrate is illuminated during processing. In this embodiment, images of the illuminated region are analyzed to determine the amount of substrate warping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.