Package for semiconductor device including guide rings and manufacturing method of the same
US8587108B2 · kind B2 · utility
2Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2011 |
| Grant date | Nov 19, 2013 |
| Priority date | — |
| Expiry date | Nov 22, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An example embodiment relates to a semiconductor package. The semiconductor package includes a first substrate including a first pad, a second substrate upwardly spaced apart from the first substrate and including a second pad opposite to the first pad. At least one electrode is coupled between the first pad and the second pad. The semiconductor package includes a guide ring formed at a periphery of the electrode between the first substrate and the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.