Semiconductor package and method of attaching semiconductor dies to substrates
US8592258B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Oct 20, 2011 |
| Grant date | Nov 26, 2013 |
| Priority date | — |
| Expiry date | Feb 23, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07802
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 kgf, the heat has a temperature range from approximately 150 to 200° C. and the pressure is applied for a range of approximately 1 to 10 seconds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.