Patent · US Active

Device and process for liquid treatment of a wafer shaped article

US8596623B2 · kind B2 · utility

6Cited by

3References

13Claims

0Family size

Assignee

Lam Research Corporation · US

Inventors

Dieter Frank · Friesach, AT
Michael PUGGL · Zeltweg, AT

Key dates

Filing date	Dec 18, 2009
Grant date	Dec 3, 2013
Priority date	—
Expiry date	Jul 9, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/68735
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A spin chuck in an apparatus for single wafer wet processing has structures at its periphery that, in combination with a supported wafer, form a series of annular nozzles that direct flowing gas from a chuck-facing surface of the wafer, around the edge of the wafer, and exhaust the gas away from the non-chuck-facing surface of the wafer, thereby preventing treatment fluid applied to the non-chuck-facing surface from contacting the edge region of the wafer. Retaining pins with enlarged heads engage the wafer edge and prevent it from being displaced upwardly when a high flow rate of gas is utilized.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.