Method for bonding of chips on wafers
US8597980B2 · kind B2 · utility
1Cited by
4References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 13, 2009 |
| Grant date | Dec 3, 2013 |
| Priority date | — |
| Expiry date | Mar 13, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/157
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method for bonding a plurality of chips onto a base wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.