Decryption of configuration data for multi-die integrated circuits
US8601306B1 · kind B1 · utility
4Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2010 |
| Grant date | Dec 3, 2013 |
| Priority date | — |
| Expiry date | May 8, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of loading configuration data within an integrated circuit that includes multiple dies is disclosed. The method can include receiving configuration data in encrypted form within a first die of the multiple dies of the integrated circuit and decrypting the configuration data within the first die to generate configuration data in unencrypted form. A portion of the configuration data in unencrypted form can be distributed from the first die to each other die of the multiple dies through an interposer to which each die is attached.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.