Room temperature bonding using sputtering
US8602289B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 6, 2007 |
| Grant date | Dec 10, 2013 |
| Priority date | — |
| Expiry date | Sep 6, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/36
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. Preferably, the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.