System and method for varying wafer surface temperature via wafer-carrier temperature offset
US8603248B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2006 |
| Grant date | Dec 10, 2013 |
| Priority date | — |
| Expiry date | Jun 7, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4586
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A system and method for evenly heating a substrate placed in a wafer carrier used in wafer treatment systems such as chemical vapor deposition reactors, wherein a first pattern of wafer compartments is provided on the top of the wafer carrier, such as one or more rings of wafer carriers, and a second pattern of inlaid material dissimilar to the wafer carrier material is inlaid on the bottom of the wafer carrier, and the second pattern of inlaid material is substantially the opposite of the first pattern of wafer compartments, such that there are at least as many material interfaces in intermediate regions without wafer compartments as there are in wafer carrying regions with wafers and wafer compartments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.