Patent · US Active

Method for stripping a wafer from a carrier

US8603294B2 · kind B2 · utility

0Cited by

15References

9Claims

0Family size

Assignee

EV Group GmbH · AT

Inventor

Erich Thallner · St. Florian, AT

Key dates

Filing date	Feb 6, 2013
Grant date	Dec 10, 2013
Priority date	—
Expiry date	Feb 6, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1967
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Method for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer. The method includes the steps of accommodating the carrier-wafer combination on a receiving means, breaking the connection provided by the interconnect layer by a connection release means, and stripping the wafer from the carrier, or stripping the carrier from the wafer by stripping means.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.