Integrated circuit package system employing multi-package module techniques
US8609463B2 · kind B2 · utility
6Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2007 |
| Grant date | Dec 17, 2013 |
| Priority date | — |
| Expiry date | Feb 23, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package system that includes: providing a first package including a first package first device and a first package second device both adjacent a first package substrate; and mounting and electrically interconnecting a second package over an electrical interconnect array formed on a substrate of the first package second device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.