Heat pipe and circuit board with a heat pipe function
US8611089B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 9, 2009 |
| Grant date | Dec 17, 2013 |
| Priority date | — |
| Expiry date | Jan 21, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like lower plate opposed to the upper plate, and a plurality of flat plate-like intermediate plates overlaid on each other between the upper plate and the lower plate and having internal through-holes. The internal through-holes formed in each of a plurality of the intermediate plates are adapted such that only part of each through-hole is overlapped on each other to form capillary tube paths, each having a cross-sectional area smaller than the cross-sectional area of the through-hole in the flat surface direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.