Patent · US Active

Method and system for heterogeneous substrate bonding of waveguide receivers

US8611388B2 · kind B2 · utility

159Cited by
19References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 3, 2011
Grant dateDec 17, 2013
Priority date—
Expiry dateAug 5, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01S5/0237
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A composite integrated optical device includes a substrate including a silicon layer and a waveguide disposed in the silicon layer. The composite integrated optical device also includes an optical detector bonded to the silicon layer and a bonding region disposed between the silicon layer and the optical detector. The bonding region includes a metal-assisted bond at a first portion of the bonding region. The metal-assisted bond includes an interface layer positioned between the silicon layer and the optical detector. The bonding region also includes a direct semiconductor-semiconductor bond at a second portion of the bonding region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.