Grounded lid for micro-electronic assemblies
US8614900B2 · kind B2 · utility
3Cited by
23References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 2011 |
| Grant date | Dec 24, 2013 |
| Priority date | — |
| Expiry date | Feb 3, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.