Thermocouple
US8616765B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2012 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Jul 31, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K13/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.