Electronic device and manufacturing thereof
US8618644B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2012 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Aug 27, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.