Integrated circuit package system with wafer scale heat slug
US8618653B2 · kind B2 · utility
1Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2008 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Mar 14, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package system includes: providing a singulated, layered structure equivalent in size to an integrated circuit die and having an adhesive layer, an electrical insulator layer, and a heat slug; attaching the integrated circuit die to a base; attaching bond wires to a top of the base for electrical connection between the integrated circuit die and the base; attaching the singulated, layered structure to the integrated circuit die wherein the bond wires are surrounded by the adhesive layer; and encapsulating the integrated circuit die and a portion of the heat slug with a molding compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.