Electroless plating system
US8622017B2 · kind B2 · utility
0Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 2011 |
| Grant date | Jan 7, 2014 |
| Priority date | — |
| Expiry date | May 19, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1682
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless plating system includes a plating solution, and controlling reducing agents in the plating solution for deposition over outlier features smaller than about five hundred nanometers and isolated by about one thousand nanometers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.