Adhesive/spacer island structure for multiple die package
US8623704B2 · kind B2 · utility
4Cited by
135References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2006 |
| Grant date | Jan 7, 2014 |
| Priority date | — |
| Expiry date | Dec 7, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive/spacer structure (52, 52A, 60) is used to adhere first and second die (14, 18) to one another at a chosen separation in a multiple-die semiconductor chip package (56). The first and second die define a die bonding region (38) therebetween. The adhesive/spacer structure may comprise a plurality of spaced-apart adhesive/spacer islands (52, 52A) securing the first and second die to one another at a chosen separation (53). The adhesive/spacer structure may also secure the first and second die to one another to occupy about 1-50% of the die bonding region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.