Methods for de-bonding carriers
US8629043B2 · kind B2 · utility
0Cited by
52References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2011 |
| Grant date | Jan 14, 2014 |
| Priority date | — |
| Expiry date | Dec 30, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes performing a dicing on a composite wafer including a plurality of dies, wherein the composite wafer is bonded on a carrier when the step of dicing is performed. After the step of dicing, the composite wafer is mounted onto a tape. The carrier is then de-bonded from the composite wafer and the first tape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.