Sub-micrometer gap thermophotovoltaic structure (MTPV) and fabrication method therefor
US8633373B2 · kind B2 · utility
2Cited by
5References
26Claims
0Family size
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Key dates
| Filing date | May 12, 2008 |
| Grant date | Jan 21, 2014 |
| Priority date | — |
| Expiry date | Feb 4, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An MTPV thermophotovoltaic chip comprising a photovoltaic cell substrate, micron/sub-micron gap-spaced from a juxtaposed heat or infrared radiation-emitting substrate, with a radiation-transparent intermediate window substrate preferably compliantly adhered to the photovoltaic cell substrate and bounding the gap space therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.