Semiconductor package with mechanical fuse
US8633551B1 · kind B1 · utility
26Cited by
1References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2012 |
| Grant date | Jan 21, 2014 |
| Priority date | — |
| Expiry date | Jul 17, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package having a mechanical fuse therein and methods to form a semiconductor package having a mechanical fuse therein are described. For example, a semiconductor structure includes a semiconductor package. A semiconductor die is housed in the semiconductor package. A microelectromechanical system (MEMS) device is housed in the semiconductor package. The MEMS device has a suspended portion. A mechanical fuse is housed in the semiconductor package and either coupled to, or decoupled from, the suspended portion of the MEMS device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.