Electro chemical deposition systems and methods of manufacturing using the same

US8636879B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Moosung Chae · Poughkeepsie, US
• Bum Ki Moon · Oshima, JP
• Sunoo Kim · Hopewell Junction, US
• Danny Pak-Chum Shum · Poughkeepsie, US

Key dates

• Filing date: Apr 20, 2012
• Grant date: Jan 28, 2014
• Expiry date: Jul 19, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/2885
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

An electro chemical deposition system is described for forming a feature on a semiconductor wafer. The electro chemical deposition is performed by powering electrodes that includes a cathode, an anode and a plurality of electrically independent auxiliary electrodes.