Heating plate with planar heating zones for semiconductor processing
US8637794B2 · kind B2 · utility
72Cited by
69References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2009 |
| Grant date | Jan 28, 2014 |
| Priority date | — |
| Expiry date | Oct 25, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49099
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heating plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar heater zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. A substrate support assembly in which the heating plate is incorporated includes an electrostatic clamping electrode and a temperature controlled base plate. Methods for manufacturing the heating plate include bonding together ceramic or polymer sheets having planar heater zones, power supply lines, power return lines and vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.