Neil Benjamin
78Patents
17h-index
64Co-inventors
87Inventor score
Filing activity: Mar 29, 1996 → Oct 20, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6847014B1 | Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support | Electricity | 637 | Expired |
| US7497614B2 | Apparatus for determining a temperature of a substrate and methods therefor | Physics | 452 | Active |
| US5820723A | Universal vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and/or cantilevered substrate support | Electricity | 347 | Expired |
| US5863376A | Temperature controlling method and apparatus for a plasma processing chamber | Electricity | 204 | Expired |
| US7274004B2 | Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support | Electricity | 155 | Expired |
| US6483690B1 | Ceramic electrostatic chuck assembly and method of making | Electricity | 99 | Expired |
| US8637794B2 | Heating plate with planar heating zones for semiconductor processing | Emerging Cross-Sectional Technologies | 72 | Active |
| US6920312B1 | RF generating system with fast loop control | Electricity | 60 | Expired |
| US6344105B1 | Techniques for improving etch rate uniformity | Emerging Cross-Sectional Technologies | 55 | Expired |
| US8884194B2 | Heating plate with planar heater zones for semiconductor processing | Emerging Cross-Sectional Technologies | 48 | Active |
| US5708250A | Voltage controller for electrostatic chuck of vacuum plasma processors | Emerging Cross-Sectional Technologies | 44 | Expired |
| US5793192A | Methods and apparatuses for clamping and declamping a semiconductor wafer in a wafer processing system | Emerging Cross-Sectional Technologies | 35 | Expired |
| US8271121B2 | Methods and arrangements for in-situ process monitoring and control for plasma processing tools | Electricity | 35 | Active |
| US9051647B2 | Tunable multi-zone gas injection system | Electricity | 31 | Active |
| US6901808B1 | Capacitive manometer having reduced process drift | Physics | 23 | Expired |
| US7080941B1 | Temperature sensing system for temperature measurement in a high radio frequency environment | Physics | 19 | Expired |
| US6563076B1 | Voltage control sensor and control interface for radio frequency power regulation in a plasma reactor | Electricity | 17 | Expired |
| US8755204B2 | RF isolation for power circuitry | Electricity | 16 | Active |
| US6653852B1 | Wafer integrated plasma probe assembly array | Electricity | 15 | Expired |
| US8809747B2 | Current peak spreading schemes for multiplexed heated array | Electricity | 15 | Active |
| US6087778A | Scalable helicon wave plasma processing device with a non-cylindrical source chamber having a serpentine antenna | Electricity | 13 | Expired |
| USRE47276E1 | RF isolation for power circuitry | General | 12 | Active |
| US8692467B2 | Synchronized and shortened master-slave RF pulsing in a plasma processing chamber | Electricity | 12 | Active |
| US10403475B2 | Tunable multi-zone gas injection system | Electricity | 12 | Active |
| US6974550B2 | Apparatus and method for controlling the voltage applied to an electrostatic shield used in a plasma generator | Electricity | 11 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.