Semiconductor device
US8637922B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2012 |
| Grant date | Jan 28, 2014 |
| Priority date | — |
| Expiry date | Jul 19, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/518
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method provides a semiconductor device having a semiconductor body defining a source region, a body region, a drift region and a diode region. The drift region has a first drift region section and a second drift region section. The diode region is buried within the drift region, and has a semiconductor type opposite to the drift region to form a diode. The diode region is separated from the gate electrode by the first drift region section extending from the diode region in a vertical direction. The gate electrode is adjacent the body region and insulated from the body region by a gate dielectric. A source electrode is electrically connected to the source region, the body region and the diode region. A semiconductor region of a doping type opposite to the doping type of the drift region is arranged between the first drift region section and the source electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.