Anti-tamper wrapper interconnect method and a device
US8637985B2 · kind B2 · utility
2Cited by
0References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2012 |
| Grant date | Jan 28, 2014 |
| Priority date | — |
| Expiry date | Feb 10, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4015
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for electrically coupling an anti-tamper mesh to an electronic module or device using wire bonding equipment and a device made from the method. Stud bumps or free air ball bonds are electrically coupled to conductive mesh pads of an anti-tamper mesh. Respective module pads have a conductive epoxy disposed thereon for the receiving of the stud bumps or free air ball bonds, each of which are aligned and bonded together to electrically couple the anti-tamper mesh to predetermined module pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.