Apparatus, device and method for determining alignment errors
US8640548B2 · kind B2 · utility
21Cited by
0References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 7, 2011 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | Oct 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67259
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to an apparatus, a device and a method for determining local alignment errors which have occurred due to strain and/or distortion of a first substrate relative to a second substrate when the first substrate is joined to the second substrate and for alignment of two wafers by means of position maps, strain maps and/or stress maps of wafers which are recorded during and/or after alignment of the wafers, especially through at least one transparent region of at least one of the wafers, optionally the relative position of the two wafers to one another being corrected especially in-situ.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.