Solder alloy

US8641964B2 · kind B2 · utility

Assignee

• Fry's Metals, Inc. · US

Inventors

• Brian G. Lewis · Branford, US
• Bawa Singh · Cherry Hill, US
• John P. Laughlin · Tucson, US
• Ranjit Pandher · South Plainfield, US

Key dates

• Filing date: Feb 25, 2008
• Grant date: Feb 4, 2014
• Expiry date: May 1, 2029

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C22C13/00
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

An alloy suitable for use in a ball grid array or chip scale package comprising from 0.05-1.5 wt. % copper, from 0.1-2 wt. % silver, from 0.005-0.3 wt % nickel, from 0.003-0.3 wt % chromium, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % of one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminum, from 0-0.3 wt. % zinc, from 0-2 wt. % bismuth, from 0-1 wt. % antimony, from 0-0.2 wt % manganese, from 0-0.3 wt % cobalt, from 0-0.3 wt % iron, and from 0-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.