Method of optimizing a die size, method of designing a pattern device manufacturing method, and computer program product
US8642235B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2012 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | May 31, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70433
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of optimizing a die size in a method of manufacturing devices using a lithographic apparatus, wherein the lithographic apparatus is arranged to expose an image field of variable size in a single exposure step, the image field having a certain maximum size, the method comprising: receiving a desired area for the die; and calculating a target aspect ratio for the die, wherein the target aspect ratio is determined so as to maximize the number of good dies that can be imaged per hour using the lithographic apparatus. Desirably, calculating a target aspect ratio comprises finding a first target aspect ratio that maximizes a figure of merit MF, where MF is the ratio of the number of dies exposed in each image field divided by the number of exposures on each substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.