Patent · US Active

Semiconductor device

US8642408B2 · kind B2 · utility

0Cited by

10References

24Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ralf Otremba · Kaufbeuren, DE
Joachim Mahler · Regensburg, DE
Bernd Rakow · Regensburg, DE
Reimund Engl · Munich, DE
Rupert Fischer · Maxhütte-Haidhof, DE

Key dates

Filing date	Oct 7, 2010
Grant date	Feb 4, 2014
Priority date	—
Expiry date	Aug 4, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device and method is disclosed. One embodiment provides a method comprising placing a first semiconductor chip on a carrier. After placing the first semiconductor chip on the carrier, an electrically insulating layer is deposited on the carrier. A second semiconductor chip is placed on the electrically insulating layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.