Patent · US Active

Strain and kinetics control during separation phase of imprint process

US8652393B2 · kind B2 · utility

13Cited by
26References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 23, 2009
Grant dateFeb 18, 2014
Priority date
Expiry dateJan 28, 2031

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F7/0002
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

Systems and methods for improving robust layer separation during the separation process of an imprint lithography process are described. Included are methods of matching strains between a substrate to be imprinted and the template, varying or modifying the forces applied to the template and/or the substrate during separation, or varying or modifying the kinetics of the separation process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.