Method of CVD-depositing a film having a substantially uniform film thickness
US8652573B2 · kind B2 · utility
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3References
27Claims
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Key dates
| Filing date | Jul 14, 2011 |
| Grant date | Feb 18, 2014 |
| Priority date | — |
| Expiry date | Mar 11, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/45523
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Method of depositing a film having a substantially uniform thickness by means of chemical vapor deposition, comprising:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.