Flat covered leadless pressure sensor assemblies suitable for operation in extreme environments
US8656784B2 · kind B2 · utility
6Cited by
8References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2011 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Mar 14, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An enclosed, flat covered leadless pressure sensor assembly suitable for extreme environment operation including dynamic, ultra-high temperature heating, light and heat flash, and high-speed, flow-related environments. The pressure sensor assembly comprises a substrate comprising a micromachined sensing diaphragm defined on a first side. A cover is attached to the first side of the substrate such that it covers at least the sensing diaphragm. The top surface of the cover is substantially flat, thereby promoting uniformity in the distribution of stress and thermal effects across a top surface of the cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.