Eddy current sensor and polishing method and apparatus
US8657644B2 · kind B2 · utility
2Cited by
4References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2011 |
| Grant date | Feb 25, 2014 |
| Priority date | — |
| Expiry date | Dec 7, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/105
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An eddy current sensor is used for detecting a metal film (or conductive film) formed on a surface of a substrate such as a semiconductor wafer. The eddy current sensor includes a sensor coil disposed near a metal film or a conductive film formed on a substrate, and the sensor coil includes a detection coil operable to detect an eddy current produced in the metal film or the conductive film. The detection coil includes a coil formed by winding a wire by a single row and plural layers, the row being defined as a direction perpendicular to the substrate and the layer being defined as a direction parallel to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.