Patent · US Active

Leak proof pad for CMP endpoint detection

US8662957B2 · kind B2 · utility

5Cited by

10References

12Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Young J. Paik · Campbell, US
Christopher R. Mahon · San Bruno, US
Ashish Bhatnagar · Fremont, US
Kadthala Ramaya Narendrnath · San Jose, US

Key dates

Filing date	Jun 28, 2010
Grant date	Mar 4, 2014
Priority date	—
Expiry date	Feb 11, 2032

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B49/12
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

In one aspect, a polishing pad includes a homogeneous unitary polishing layer having a polishing surface, an opposed bottom surface, a recess in the polishing surface extending partially but not entirely through the polishing layer, and a solid light-transmissive window is secured in the recess. In another aspect, a polishing pad includes a polishing layer having a polishing surface, and the polishing surface includes a first region having a first plurality of grooves with a first depth extending partially but not entirely through the polishing layer and a second region surrounded by the first region and having a second plurality of grooves with a second depth extending partially but not entirely through the polishing layer, the second depth greater than the first depth.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.