Patent · US Active

Semiconductor device with protruding component portion and method of packaging

US8664753B2 · kind B2 · utility

0Cited by

3References

25Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Teck Sim Lee · Melaka City, MY
Chee Voon Tan · Seremban, MY
Kwai Hong Wong · Melaka City, MY

Key dates

Filing date	Nov 25, 2009
Grant date	Mar 4, 2014
Priority date	—
Expiry date	Apr 10, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package device having a protruding component portion and a method of packaging the semiconductor device is disclosed. The semiconductor device has a component, such as a leadframe, and a packaging mold body. The packaging mold body is formed around a portion of the component and a recess is formed in the packaging mold body adjacent the protruding portion of the component to prevent the protruding portion of the component from damaging other adjacent and abutting semiconductor devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.