Methods for enhanced fluid delivery on bevel etch applications
US8671965B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2012 |
| Grant date | Mar 18, 2014 |
| Priority date | — |
| Expiry date | Nov 5, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/0318
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus to supply a plurality of process fluids for processing a substrate in a semiconductor processing chamber. The apparatus includes a plurality of process fluid supply valves and a fluid supply network that is defined between a crossover valve and a tuning supply valve. The apparatus further includes a tuning fluid supply being connected to the fluid supply network through the tuning supply valve. Further included with the apparatus is a plurality of process fluids that are connected to the fluid supply network through the plurality of process fluid supply valves. A process chamber that has a substrate support is also included in the apparatus. The process chamber further including an edge fluid supply and a center fluid supply, the edge fluid supply connected to the fluid supply network through an edge enable valve and the center supply connected to the fluid supply network through a center enable valve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.