Automatic focus and emissivity measurements for a substrate system
US8674257B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 11, 2008 |
| Grant date | Mar 18, 2014 |
| Priority date | — |
| Expiry date | Jun 11, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/0007
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for thermally processing a substrate includes a first radiation source configured to heat a substrate and emit radiation at a heating wavelength, focusing optics configured to direct radiation from the first radiation source to the substrate, and a second radiation source configured to emit radiation at a second wavelength different from the heating wavelength and at a lower power than the first radiation source. Radiation from the second radiation source is directed onto the substrate. The apparatus further includes a first detector configured to receive reflected radiation at the second wavelength and a computer system configured to receive an output from the first detector and adjust a focus plane of the first radiation source relative to the substrate. The second radiation source is configured to have substantially the same focus plane as the first radiation source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.