Patent · US Active

Aqueous, acid bath and method for the electrolytic deposition of copper

US8679316B2 · kind B2 · utility

22Cited by

6References

18Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Heiko Brunner · Berlin, DE
Bernd Roelfs · Berlin, DE
Dirk Rohde · Berlin, DE
Thomas Pliet · Berlin, DE

Key dates

Filing date	Apr 27, 2009
Grant date	Mar 25, 2014
Priority date	—
Expiry date	Oct 21, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/421
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

An aqueous, acid bath for the electrolytic deposition of copper contains at least one copper ion source, at least one acid ion source, at least one brightener compound, and at least one leveler compound, and generates a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches. The leveler compound is selected from among synthetically produced non-functionalized peptides, synthetically produced functionalized peptides, and synthetically produced functionalized amino acids.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.