Integrated circuit packaging system with heat conduction and method of manufacture thereof
US8679900B2 · kind B2 · utility
6Cited by
9References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2011 |
| Grant date | Mar 25, 2014 |
| Priority date | — |
| Expiry date | Dec 14, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; mounting a lid base over the substrate, the lid base having a base indentation and a hole with the integrated circuit within the hole; and mounting a heat slug over the lid base, the heat slug having a slug non-horizontal side partially within the base indentation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.