Minjung Kim
100Patents
7h-index
243Co-inventors
73Inventor score
Filing activity: Jul 24, 2006 → Oct 10, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8802259B2 | Battery pack of compact structure | Emerging Cross-Sectional Technologies | 22 | Active |
| US8304104B2 | Battery module having heat dissipation member of novel structure and battery pack employed with the same | Emerging Cross-Sectional Technologies | 21 | Active |
| US8722224B2 | Middle or large-sized battery pack of improved cooling efficiency | Emerging Cross-Sectional Technologies | 19 | Active |
| US9184477B2 | Battery pack of excellent cooling efficiency | Emerging Cross-Sectional Technologies | 17 | Active |
| US9413043B2 | Cooling member of improved assembly efficiency and battery module employed with the same | Emerging Cross-Sectional Technologies | 16 | Active |
| US9614260B2 | Battery pack of excellent cooling efficiency | Emerging Cross-Sectional Technologies | 16 | Active |
| US9971365B2 | Air conditioner management system comprising a user interface device and a central management device and method for controlling air conditioner by the air conditioner management system | Mechanical Engineering; Lighting; Heating | 7 | Active |
| US8679900B2 | Integrated circuit packaging system with heat conduction and method of manufacture thereof | Electricity | 6 | Active |
| US9693455B1 | Integrated circuit packaging system with plated copper posts and method of manufacture thereof | Electricity | 6 | Active |
| US8372695B2 | Integrated circuit packaging system with stack interconnect and method of manufacture thereof | Electricity | 4 | Active |
| US9281228B2 | Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor die | Electricity | 4 | Active |
| US8703535B2 | Integrated circuit packaging system with warpage preventing mechanism and method of manufacture thereof | Electricity | 4 | Active |
| US8710670B2 | Integrated circuit packaging system with coupling features and method of manufacture thereof | Electricity | 4 | Active |
| US8409918B2 | Semiconductor device and method of forming pre-molded substrate to reduce warpage during die mounting | Electricity | 4 | Active |
| US8710640B2 | Integrated circuit packaging system with heat slug and method of manufacture thereof | Electricity | 4 | Active |
| US11688081B2 | Method of performing simultaneous localization and mapping with respect to a salient object in an image | Physics | 4 | Active |
| US10750629B2 | Method for manufacturing exterior housing and electronic device comprising same | Performing Operations; Transporting | 3 | Active |
| US10803385B2 | Device including battery | Emerging Cross-Sectional Technologies | 3 | Active |
| US9274423B2 | Fluorine-based resins and photosensitive resin composition comprising the same | Physics | 2 | Active |
| US10470620B2 | Bathroom management apparatus | Human Necessities | 2 | Active |
| US9134952B2 | Terminal and control method thereof | Electricity | 2 | Active |
| US10674555B2 | Electronic device and method for forming Wi-Fi direct group thereof | Electricity | 2 | Active |
| US8435666B2 | Battery module with excellent cooling efficiency and compact structure and middle or large-sized battery pack | Emerging Cross-Sectional Technologies | 2 | Active |
| US11297666B2 | Electronic device and method for forming Wi-Fi direct group thereof | Electricity | 2 | Active |
| US11516930B2 | Method for manufacturing exterior housing and electronic device comprising same | Performing Operations; Transporting | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.