Automatic virtual metrology for semiconductor wafer result prediction
US8682466B2 · kind B2 · utility
8Cited by
65References
17Claims
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Key dates
| Filing date | Feb 5, 2008 |
| Grant date | Mar 25, 2014 |
| Priority date | — |
| Expiry date | Sep 26, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B23/0221
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A method to enable wafer result prediction includes collecting manufacturing data from various semiconductor manufacturing tools and metrology tools; choosing key parameters using an autokey method based on the manufacturing data; building a virtual metrology based on the key parameters; and predicting wafer results using the virtual metrology.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.