Patent · US Active

Cover structure with integrated chip and antenna

US8684273B2 · kind B2 · utility

0Cited by

1References

8Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Peter Scherl · Regensburg, DE
Frank Pueschner · Kelheim, DE
Juergen Hoegerl · Regensburg, DE

Key dates

Filing date	Sep 26, 2012
Grant date	Apr 1, 2014
Priority date	—
Expiry date	Sep 26, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49016
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

In various embodiments, a cover structure for a personal identification document is provided. The cover structure may include a cover formed as a single layer; a chip module; the cover having a recess for completely receiving the chip module; and an antenna that is connected to the chip module.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.